Protecting the edge: Ultrafast laser modified C-shaped glass edges

A procedure and optical concept is introduced for ultrashort pulsed laser cleaving of transparent materials with tailored edges in a single pass. The based on holographically splitting number foci along the desired edge geometry including C-shaped local 45° tangential angles to surface. Single-pass, full-thickness modifications are achieved requiring single-side access workpiece only without inclining head. After having induced feed rates ?1m/s, actual separation performed using selective etching strategy.